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 VN330SP(8932)
QUAD HIGH SIDE SMART POWER SOLID STATE RELAY
Table 1. General Features
Type VN330SP(8932)
(*) Per channel (**) at Tj=85C s s
Figure 1. Package
RDSon (*) 0.32 (**) Iout (*) 1A Vcc 36V
Vdemag(*) VCC-55V
OUTPUT CURRENT: 1A PER CHANNEL
DIGITAL INPUTS CLAMPED AT 32V MINIMUM VOLTAGE
10
s
SHORTED LOAD AND OVERTEMPERATURE PROTECTIONS
BUILT-IN CURRENT LIMITER
1
s s s s
PowerSO-10TM
UNDERVOLTAGE SHUTDOWN
OPEN DRAIN DIAGNOSTIC OUTPUT FAST DEMAGNETIZATION OF INDUCTIVE LOADS
DESCRIPTION The VN330SP(8932) is a monolithic device made using STMicroelectronics VIPower M0-3 Technology, intended for driving four indipendent resistive or inductive loads with one side connected to ground.
Active current limitation avoids dropping the system power supply in case of shorted load. Built-in thermal shut-down protects the chip from overtemperature and short-circuit. The open drain diagnostic output indicates short-circuit and overtemperature conditions.
Table 2. Order Codes
Package Tube VN330SP(8932) Tape and Reel
PowerSO-10
VN330SP(8932)TR
Rev. 1 September 2004 1/12
VN330SP(8932)
Figure 2. Block Diagram
Table 3. Absolute Maximum Ratings
Symbol VCC - VCC IOUT IR IIN IDIAG VESD EAS Ptot Tj TSTG Parameter Power Supply Voltage Reverse Supply Voltage Output Current (cont.) Reverse Output Current (per channel) Input Current (per channel) DIAG Pin Current Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) Single Pulse Avalanche Energy per Channel Not Simultaneously (see figure 5) Power Dissipation TC25C Junction Operating Temperature Storage Temperature Value 45 - 0.3 Internally Limited -6 +/- 10 +/- 10 2000 400 Internally Limited Internally limited - 55 to 150 Unit V V A A mA mA V mJ W C C
Figure 3. Configuration Diagram (Top View) & Suggested Connections for Unused and N.C. Pins
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VN330SP(8932)
Figure 4. Current and Voltage Conventions
Table 4. Thermal Data
Symbol Rthj-case Rthj-amb
(1) (2)
Parameter Thermal Resistance Junction-case (1) Thermal Resistance Junction-ambient (2)
Max Max
Value 2 50
Unit C/W C/W
All channels ON. When mounted using minimum recommended pad size on FR-4 board.
ELECTRICAL CHARACTERISTICS (10VSymbol VCC RON IS Vdemag Parameter Supply Voltage On State Resistance Supply Current Test Conditions IOUT=0.5A; Tj =125C IOUT=10A All channels Off; VIN=30V Min 10 Typ Max 36 0.4 0.32 1 10 VCC-65 VCC-55 VCC-45 Unit V mA mA V
OnState; Tj=125C; IOUT1...IOUT4=0 Output Voltage at Turn-Off IOUT=0.5A; LLOAD=1mH
Table 6. Logic Input (each channel)
Symbol VIL VIH VI(hyst) IIN ILGND VICL Parameter Input Low Level Voltage Input High Level Voltage Input Hysteresis Voltage Input Current Output Current in Ground Disconnection Input Clamp Voltage (See note 1) VIN=0 to 30V VIN=0 to 2V VCC=VINX=GND=DIAG=24V; Tj =25C IIN= 1mA IIN= - 1mA 32 36 -0.7 25 25 (See note 1) 3.5 0.5 600 Test Conditions Min Typ Max 2 Unit V V V A A mA V V
Note: 1. The input voltage is internally clamped at 32V minimum, it is possible to connect the input pins to an higher voltage via an external resistor calculate to not exceed 10 mA.
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VN330SP(8932)
ELECTRICAL CHARACTERISTICS (continued) Table 7. Switching (VCC =24V)
Symbol Parameter Turn-on Delay Time of Output Current Test Conditions IOUT=0.5A; Resistive Load Input Rise Time < 0.1s Tj=25C Tj=125C IOUT=0.5A; Resistive Load tr Rise Time of Output Current Input Rise Time < 0.1s Tj=25C Tj=125C IOUT=0.5A; Resistive Load td(off) Turn-off Delay Time of Output Current Input Rise Time < 0.1s Tj=25C Tj=125C IOUT=0.5A; Resistive Load tf Fall Time of Output Current Input Rise Time < 0.1s Tj=25C Tj=125C IOUT=0.5A IOUT=Ilim; Tj =25C IOUT=0.5A IOUT=Ilim; Tj =25C 8 15 20 0.5 2 2 4 s s A/s A/s A/s A/s 20 30 40 s s 50 100 115 s s 30 40 60 s s Min Typ Max Unit
td(on)
(di/dt)on (di/dt)off
Turn-on Current Slope Turn-off Current Slope
Table 8. Protections
Symbol VSTAT (3) VSCL (3) VUSD Ilim IOVPK IDIAGH ILOAD tSC TTSD TR Parameter Test Conditions Status Voltage Output Low ISTAT=5mA (Fault condition) ISTAT= 1mA Status Clamp Voltage ISTAT= - 1mA Undervoltage Shut-down DC Short Circuit Current VCC=24V; RLOAD < 10m VCC=24V; VIN=30V; Peak Short Circuit Current RLOAD < 10m (See figure 6) Leakage on Diag Pin in VDIAG=24V High State VCC=10 to 36V; VIN=0V; Output Leakage Current 4 Channels In Parallel Delay Time of Current Limiter Thermal Shut-Down Temperature Reset Temperature Min 32 5 1 Typ 36 0.7 8 2.5 4 100 25 100 150 135 170 155 Max 1 Unit V V V V A A A A s C C
Note: (3) Status determination > 100 ms after the switching edge. Note: If INPUTn pin is left floating the corresponding channel will automatically switch off. If GND pin is disconnetted, all channels will switch off provided VCC does not exceed 36V
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VN330SP(8932)
Figure 5. Avalanche Energy Test Circuit
Figure 6. Peak Short Circuit Current Test Circuit
5/12
VN330SP(8932)
Table 9. Truth Table
CONDITIONS Normal operation Overtemperature Undervoltage Shorted Load (Current Limitation) INPUTn L H L H L H L H OUTPUTn L H L L L L L H DIAGNOSTIC H H H L H H H H
Figure 7. Switching Waveforms
6/12
VN330SP(8932)
Figure 8. Switching Parameters Test Conditions
Figure 9. Driving Circuit
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VN330SP(8932)
PowerSO-10TM Thermal Data Figure 10. PowerSO-10TM PC Board
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2).
Figure 11. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/W)
55
Tj-Tamb=50C
50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)
8/12
VN330SP(8932)
PACKAGE MECHANICAL Table 10. PowerSO-10TM Mechanical Data
Symbol A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) a (*)
Note: (*) Muar only POA P013P
millimeters Min 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 1.35 1.40 14.40 14.35 Typ Max 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30
Figure 12. PowerSO-10TM Package Dimensions
B
0.10 A B
10
H
E
E2
E4
1
SEATING PLANE e
0.25
B
DETAIL "A"
A
C D = D1 = = = SEATING PLANE
h
A F A1
A1
L DETAIL "A"
P095A
9/12
VN330SP(8932)
Figure 13. PowerSO-10TM Suggested Pad Layout And Tube Shipment (No Suffix)
14.6 - 14.9 10.8 - 11 6.30
A A C C
CASABLANCA
B
MUAR
0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 0.54 - 0.6
B
9.5
All dimensions are in mm.
1.27
Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532
A
B
C ( 0.1) 0.8 0.8
10.4 16.4 4.9 17.2
Figure 14. Tape And Reel Shipment (suffix "TR") REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components
10/12
VN330SP(8932)
REVISION HISTORY Table 11. Revision History
Date Sep-2004 Revision 1 - First Issue Description of Changes
11/12
VN330SP(8932)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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